IC test instrument
US5280236A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1992 |
| Grant date | Jan 18, 1994 |
| Priority date | — |
| Expiry date | Jan 22, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06711
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An IC test instrument has an IC test circuit for an integrated semiconductor chip. A probe card is coupled to the IC test circuit. Probe needles are disposed on the probe card. The probe needles comprise a cobalt-based alloy containing at least 10 weight-percent of chromium. A passive-state film comprised of chromium oxide is formed on one end of the probe needles, and a solder-enhancing metallic layer is formed on the other end of the probe needles. The passive-state film may be formed by electrolytic polishing or chemical solution immersion. The passive-state film prevents a contaminating substance, such as aluminum oxide, from adhering to the needle. The probe needle substrate may be bent and may be formed by wiredrawing a cobalt-based alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.