Patent · US Expired

Thermal overlaod fuse of surface mount compatible construction

US5280262A · kind A · utility

40Cited by
3References
13Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 19, 1993
Grant dateJan 18, 1994
Priority date
Expiry dateMar 19, 2013

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/176
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A thermal overload fuse (1) for fixation to a circuit substrate (17) comprising at least one spring arm (13) which is solderable, under fixed pre-stressed, to a contact location on the substrate, characterized in that the spring arm (13), which is fixed to an at least substantially planar frame part (2), adopts, in its relaxed state, a position which is spaced in a perpendicular direction relative to the substrate (17), in particular relative to the contact location (16); and in that the free end of the spring arm (13) is held down by at least one auxiliary web (7) onto the substrate (17), in particular onto the contact location (16); and in that the auxiliary web (7) is detachable from the frame part (2) along a predetermined line.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.