Packaging for an electronic circuit board
US5280411A · kind A · utility
17Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 1993 |
| Grant date | Jan 18, 1994 |
| Priority date | — |
| Expiry date | May 10, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1417
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A packaging for conventional printed circuit boards for protecting them from both thermal and mechanical stress. Heat conducting rails are attached to the edges of the card, and heat conducting leads used to connect heat generating components on the card to the rails. A support plate provides a rigid outer surface for the bottom of the card, with a shock absorbing layer sandwiched between the support plate and the bottom surface of the card. A heat conductive coating over the top surface of the card and its components acts as an additional heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.