Heater block for use in a bonder utilizing vacuum suction attachment means
US5281794A · kind A · utility
32Cited by
7References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 1992 |
| Grant date | Jan 25, 1994 |
| Priority date | — |
| Expiry date | Sep 2, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heater block for bonders used in a semiconductor assembly line uses a vacuum suction force to securely hold the heater plate on the heater block via vacuum passages and vacuum adhesion holes connected to a vacuum pump so that an attachment and removal of the heater plate is accomplished easily and in a short span of time by merely turning on and off the vacuum suction adhesion force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.