Method of bonding a titanium containing sputter target to a backing plate and bonded target/backing plate assemblies produced thereby
US5282943A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 1992 |
| Grant date | Feb 1, 1994 |
| Priority date | — |
| Expiry date | Jun 10, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3497
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods of bonding a titanium containing sputter target member to a heat conductive backing member, such as a copper backing plate, and bonded target/backing plate assemblies are disclosed. Due to the poor wettability of titanium based materials, a uniform, thin film of aluminum is coated thereover and acts as an anchor layer for application of tin and/or indium based solder layers thereover to securely solder bond the target and backing plate. The aluminum coating is sputter coated onto the target. Then, the coated target is heated in an oxygen containing atmosphere. The thus treated titanium target is then ready for conventional solder joining to a copper backing plate or the like by use of tin, lead, and/or indium based solder metals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.