Integrated distributed inductive-capacitive network
US5283462A · kind A · utility
47Cited by
8References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 4, 1991 |
| Grant date | Feb 1, 1994 |
| Priority date | — |
| Expiry date | Nov 4, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H1/00
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An integrated-distributed-inductive-capacitive network (100) having a high dielectric electronically-tunable semiconductor integrated capacitor. The network (100) also includes a conductive layer (126) formed on the high dielectric semiconductor integrated capacitor, to provide the distributed resistance of the network (100). External contact to the network (100) is provided via a plurality of contact terminals (122A and 122B) which are coupled to the conductive layer (126).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.