Method of mounting electronic components on a circuit board
US5283947A · kind A · utility
13Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1993 |
| Grant date | Feb 8, 1994 |
| Priority date | — |
| Expiry date | Feb 10, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Anisotropic conductive material is employed instead of solder for connecting between the terminal of a component and a printed circuit board. In addition to the printed circuit board, a printed circuit sheet is provided and the terminal of the component is sandwiched between both anisotropic materials on the printed circuit board and beneath the printed circuit sheet. From both outside surfaces of the printed circuit board and the sheet, heat and pressure are simultaneously applied to the terminal part (i.e. thermocompression bonding).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.