Magnetron sputtering cathode for vacuum coating apparatus
US5284564A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 1991 |
| Grant date | Feb 8, 1994 |
| Priority date | — |
| Expiry date | Sep 30, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a magnetron sputtering cathode for vacuum coating apparatus with a circular target plate and a plurality of magnet arrangements arranged behind the target plate and with a drive means for the continuous rotation of at least one of the magnet arrangements (12, 12') about the central axis A of the target plate, there is provided, in the radially outer marginal area of the target plate, a first magnet arrangement (15, 15', . . .) for the production of a magnetic tunnel section substantially concentric with the axis of rotation A, and between the axis of rotation A and the first magnet arrangement (15, 15', . . .) and, between the axis of rotation A and the first magnet arrangement (15, 15', . . .), a second magnet arrangement (12, 12') offset radially inwardly, and a third magnet arrangement (11, 11', . . .) which cooperate with the first magnet arrangement (15, 15', . . .) for the production of the magnetic tunnel section which extends substantially over one sector of the target plate, the second magnet system being formed from a group of individual magnets (12, 12') such that, upon a rotation of the second magnet arrangement (12, 12') about the axis of rotation (A) or of a fourth…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.