Low fuming phenolic resin prepreg and process for producing the same
US5284702A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 1991 |
| Grant date | Feb 8, 1994 |
| Priority date | — |
| Expiry date | Aug 15, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2738
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A low fuming phenolic resin prepreg comprising a fibrous base impregnated with 20 to 60% by weight of a resin composition comprising (a) 100 parts by weight of a resol phenolic resin, (b) from 1.5 to 15 parts by weight of polyacrylamide, (c) from 1.5 to 25 parts by weight of an epoxy resin, and (d) from 1.5 to 15 parts by weight of an inorganic filler, and the method for preparing the prepreg by impregnating a solution of (a), (b) and (c) having dispersed therein the filler into a fibrous base. The method for the prepreg comprising impregnating the fibrous base with the resin composition. The phenolic resin prepreg has low fuming properties as well as excellent self-adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.