Method of making a metal plug
US5284799A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 27, 1992 |
| Grant date | Feb 8, 1994 |
| Priority date | — |
| Expiry date | Mar 27, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metal plug is formed in a connection hole such as a via hole or a contact hole to provide an interconnection between multilayer wires in a semiconductor integrated circuit. First, a connection hole is formed in an insulating film, and an adhesion layer is deposited on the insulating film and in the connection hole. Then, a metal layer is deposited on the adhesion layer, and the metal layer and the adhesion layer are removed, leaving a portion of the metal layer as a metal plug in the connection hole. The metal plug includes a portion left on the insulating film in a size greater than the width of the connection hole. The connection hole may be a stepped connection hole or may have a tapered portion. The metal plug may be composed of first and second metal layers with or without the adhesion layer interposed between.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.