Low noise integrated circuit package
US5285012A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1992 |
| Grant date | Feb 8, 1994 |
| Priority date | — |
| Expiry date | Feb 18, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a package for electronic components which reduces the unwanted electronic noise generated by the package and which can be fabricated by conventional manufacturing techniques. Accordingly, a lid for a package housing is fabricated from beryllium oxide and contains a small hole. During assembly, a wire attached to one of the electronic components is inserted through the hole of this lid, and the lid is attached by conventional methods. Finally, the wire protruding through the hole is soldered to the lid, which completes the sealing of the housing and which provides for a hermetic environment for the enclosed electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.