Hybrid integrated circuit device
US5285107A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 1990 |
| Grant date | Feb 8, 1994 |
| Priority date | — |
| Expiry date | Apr 18, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/189
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hybrid integrated circuit device is provided with: a microcomputer, a plurality of peripheral circuit elements, and a non-volatile memory which is positioned adjacent to the microcomputer, all of which are interconnected by a plurality of specified conductive paths; pair of integrated circuit substrates on which is formed the conductive paths and a casing provided with the pair of integrated circuit substrates secured to the upper and lower surfaces of the casing, forming a sealed space between these surfaces. The microcomputer and the peripheral circuit elements are positioned in the sealed space and only the non-volatile memory is positioned in an exposed space. The hybrid integrated circuit device of the present invention has a compact and simple form with a high degree of mounting density as well as superior handling capabilities and reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.