Semiconductor device
US5285463A · kind A · utility
6Cited by
2References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 1, 1992 |
| Grant date | Feb 8, 1994 |
| Priority date | — |
| Expiry date | Dec 1, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0237
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a semiconductor device wherein a semiconductor chip is fixed on a mount body without a short circuit. A positive electrode (42) is provided above a conductive substrate through an insulating layer (38). The electrode (42) have a concavity (43). A bonding connector consists a first bonding connector (70) on the electrode (42) and a second bonding connector (71) around the first bonding connector (70), the first bonding connector being more fluid than the second bonding connector at a certain temperature. A LASER chip (30) is fixed on the second bonding connector (71).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.