Apparatus for mounting components
US5285946A · kind A · utility
37Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1992 |
| Grant date | Feb 15, 1994 |
| Priority date | — |
| Expiry date | Oct 9, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for mounting electronic components on the surface of printed boards by a suction head assembly 4 coupled to a head lift mechanism comprises a force sensor 6 for measuring the pressure exerted on the component by a mounting operation, and a microcomputer 1 for preparing a control signal in accordance with the deviation of the value measured by the force sensor from a desired value of pressure on the component. The rotation of a head lifting motor 51 is controlled based on the control signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.