Method of forming EMI shielded enclosures, EMI shielded enclosures and EMI shields
US5286318A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 1991 |
| Grant date | Feb 15, 1994 |
| Priority date | — |
| Expiry date | Dec 9, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0001
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A method of forming EMI shielded enclosures, an EMI shielded enclosure and EMI shield are provided. A sealer composition is applied onto a surface and is allowed to substantially dry cure into a uniform, seamless layer. An adhesive composition is applied to the dried sealer composition. Then, an electrically-conductive material, such as metallic sheet, such as copper sheeting, is attached to the dried sealer composition by the adhesive composition. Alternatively, a bonded sheet of dielectric material is applied to the adhesive composition. Then the metallic sheet is attached to the bonded sheet of dielectric material by an adhesive composition second layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.