Method of manufacturing lead frame used in electronic component
US5286342A · kind A · utility
4Cited by
5References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 5, 1992 |
| Grant date | Feb 15, 1994 |
| Priority date | — |
| Expiry date | Oct 5, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The thickness of a portion of a metal plate for constituting a lead frame, which corresponds to a tip portion of respective lead terminals of the lead frame, is partially made thin by way of an etching treatment. Subsequently, the respective lead terminals of the lead frame are formed by a punching process or an etching process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.