Magnetically attached sputter targets
US5286361A · kind A · utility
13Cited by
21References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 1992 |
| Grant date | Feb 15, 1994 |
| Priority date | — |
| Expiry date | Oct 19, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3407
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved method and assembly for attaching sputtering targets to cathode assemblies of sputtering systems which includes a magnetically permeable material. The magnetically permeable material is imbedded in a target base that is brazed, welded, or soldered to the sputter target, or is mechanically retained in the target material. Target attachment to the cathode is achieved by virtue of the permanent magnets and/or the pole pieces in the cathode assembly that create magnetic flux lines adjacent to the backing plate, which strongly attract the magnetically permeable material in the target assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.