Method and apparatus for controlling the cutting and placement of components on a moving substrate, and article made therewith
US5286543A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 1993 |
| Grant date | Feb 15, 1994 |
| Priority date | — |
| Expiry date | May 6, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24893
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A distinctive apparatus and method for selectively providing predetermined segments of web material comprises a supplying mechanism for providing the web material. A first sensing mechanism detects a reference marker on the web material to generate at least one reference marker datum which is associated with a selected web segment. A separating mechanism includes a sensor mechanism for providing at least one separation datum, and divides the web material along a separation region during a production of the web segment. A phase regulating mechanism controls a relative phasing between the reference marker detected by the first sensing mechanism and the dividing by the separating mechanism. The phasing is conducted with respect to a set reference value. An assembling mechanism places the web segment onto a substrate, and a second sensing mechanism separately detects a location of the separation region relative to the reference marker to generate at least one location datum which is in correspondence with the separation datum. A location correlating mechanism generates at least one comparison datum associated with a web segment, and a data processing mechanism evaluates the comparison …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.