Process for the formation of a negative resist pattern from a composition comprising a diazoquinone compound and an imidazole and having as a heat step the use of a hot water containing spray
US5286609A · kind A · utility
3Cited by
17References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 14, 1992 |
| Grant date | Feb 15, 1994 |
| Priority date | — |
| Expiry date | Jan 14, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/38
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A negative resist pattern is formed using a resist containing a diazoquinone sensitizer. An imagewise exposed area of a layer of the resist is subjected to heat treatment with a water-containing heating medium in the presence of a carboxyl-inactivating agent. The entire surface of the layer is exposed to radiation. The thus-exposed surface is then treated with an alkaline developer solution. An apparatus suitable for use in the practice of the above process is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.