Integrated circuit package and process for producing same
US5286926A · kind A · utility
63Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1992 |
| Grant date | Feb 15, 1994 |
| Priority date | — |
| Expiry date | Apr 15, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present integrated circuit package provides both a high density of conductor poles, and reduced crosstalk noise between the conductor poles. The conductor poles are arranged within a selected number of holes in an insulating substrate. Metallized layers for shielding the conductor poles are provided on the walls of the holes in the insulating substrate which receive the conductor poles. In addition, an insulating layer is provided on the inner circumferences of the metallized layers, which insulating layers directly surround the conductor poles to preclude direct contact between the conductor poles and the metallized layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.