Resin-encapsulated semiconductor memory device useful for single in-line packages
US5287000A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Mar 26, 1991 |
| Grant date | Feb 15, 1994 |
| Priority date | — |
| Expiry date | Mar 26, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one aspect of the present invention, a semiconductor chip, which can be mounted in a zigzag in-line type package (ZIP) partially using a tabless lead frame, includes bonding pads arranged on the chip so that the chip can be applied also to other different types of packages. These different types of packages include a small out-line J-bent type package (SOJ) which uses a lead frame with tab, and a dual in-line type package (DIP) which uses a tabless lead frame. Further, a plurality of bonding pad pairs are provided amongst the bonding pads on the chip, each pad of such bonding pad pairs having the same function as the other pad associated therewith thereby duplicating a common function in different bonding pads on the semiconductor chip so as to make the semiconductor chip compatible with a variety of or different types of packages. In accordance with another aspect of the invention, a resin-encapsulated semiconductor device of the ZIP structure is provided in which a semiconductor pellet having a plurality of external terminals disposed on a device-forming surface along each side of the planar shape is encapsulated with a resin, wherein inner leads for signals connecte…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.