Method of forming semi-solidified metal composition
US5287719A · kind A · utility
6Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1992 |
| Grant date | Feb 22, 1994 |
| Priority date | — |
| Expiry date | Aug 13, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S164/90
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
When a semi-solidified metal composition is formed in a forging die assembly, it is formed under conditions satisfying particular mass fraction solid and flowing rate in the die and then held under a given pressure until the metal composition is completely solidified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.