Method and device for producing seamless ribbon and wire loops, and their use as cuttings tools in ribbon and wire saws
US5287774A · kind A · utility
11Cited by
2References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 28, 1992 |
| Grant date | Feb 22, 1994 |
| Priority date | — |
| Expiry date | Apr 28, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S76/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The precise cutting of thin wafers from blocks or rods of hard and brittle material by means of ribbon or wire saws requires a very high strength of the sawing ribbon material or sawing wire material. In the method according to the invention, seamless metal rings are cold-rolled to form ribbon loops, optionally divided to form narrower ribbon loops or to form wire loops and optionally provided with a cutting coating. In this way, extremely strong cutting tools can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.