Method of bonding tab inner lead and bonding tool
US5288006A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1992 |
| Grant date | Feb 22, 1994 |
| Priority date | — |
| Expiry date | Mar 27, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding tool having a round pointed end smaller than the bonding pad for the semiconductor element is urged with a bonding force F.sub.1 and pressed down into the inner lead of a TAB tape such that the bonding tool end and inner lead come in close contact with each other. Then, the bonding force F.sub.1 applied to the tool is reduced to F.sub.2, while at the same time ultrasonic vibration 17 is applied to the tool, thus effecting bonding of the inner lead to the bonding pad with applied heat and pressure. Unlike the prior art, no bump has to be formed on the bonding pad for the semiconductor element or on an end of the inner lead. It is thus possible to simplify the bonding process and also to reduce the cost of bonding. Further, a highly reliable bond can be realized without causing crack or other damage to the pad structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.