Low profile fan body with heat transfer characteristics
US5288203A · kind A · utility
Inventor
Key dates
| Filing date | Oct 23, 1992 |
| Grant date | Feb 22, 1994 |
| Priority date | — |
| Expiry date | Oct 23, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
An electronic component cooling low profile fan body with favorable heat transfer characteristics is disclosed. A fan, positioned in the body, includes a number of blades circumferentially formed around a central axis. The blades establish an axial blade depth region in reference to the central axis. The low profile fan body includes a frame supporting the fan. In one embodiment of the invention, the heat transfer body includes a pressure differential surface formed around the outer perimeter of the fan blades within a first segment of the axial blade depth region. An interface surface for connection to the electronic component is positioned opposite of the fan frame. A number of heat transfer devices are disposed between the frame and the interface surface, such that the heat transfer devices are positioned within a second segment of the axial blade depth region. In an alternate embodiment of the invention, heat transfer devices are disposed between the frame and the interface surface, without a pressure differential surface, along the entire axial blade depth region. The configuration of the heat transfer devices allows them to function as both a heat transfer surface and a press…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.