Thermoplastic molding compositions which are mixtures of amorphous and semi-crystalline polyamides, a method of preparation thereof and products made therefrom
US5288799A · kind A · utility
51Cited by
4References
29Claims
0Family size
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Key dates
| Filing date | Jul 2, 1992 |
| Grant date | Feb 22, 1994 |
| Priority date | — |
| Expiry date | Jul 2, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic molding compositions including a semicrystalline polyamide a) and an amorphous copolyamide b), the latter containing dimerized fatty acid as one monomer building block. Optionally, a compatibility agent and other additives are also included. The molding compounds having high stiffness up to at least 100.degree. C. are produced by melt-mixing components a) and b), and optionally a compatibilizer, and are used for making molded parts which are outstanding in their thermal properties, high solvent resistance, and resistance to stress corrosion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.