System with cooling of electronic components on a circuit board
US5289342A · kind A · utility
30Cited by
27References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 1992 |
| Grant date | Feb 22, 1994 |
| Priority date | — |
| Expiry date | Nov 9, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/1632
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The system includes a circuit board on which electrical components are mounted. The components are mounted on the front side of the board, and the back side of the board is thermally coupled to the housing by a liquid-filled thermal heat sink pouch between the board and the housing. A heat generating component such as a microprocessor is mounted to the front side of the board, but the top surface of the component is directed toward the back side of the board such that it is also thermally coupled to the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.