Fluxless soldering process
US5289964A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1992 |
| Grant date | Mar 1, 1994 |
| Priority date | — |
| Expiry date | Jul 21, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/0233
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A fluxless soldering process comprising the steps of: preparing first and second members to be bonded by soldering, the first member having a bonding surface with a higher solder-wettability and the second member having a bonding surface with a lower solder-wettability; placing the second member with the bonding surface thereof facing upward, a solder foil on the bonding surface of the second member, and the first member on the solder foil and with the bonding surface thereof facing downward, to form an assembly; heating the assembly in a reducing atmosphere to fuse the solder foil, thereby forming a molten solder between the first and second members; and cooling the assembly to solidify the molten solder, thereby bonding the first and second members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.