Thermoplastic low-profile additives and use thereof in unsaturated polyester resin compositions
US5290854A · kind A · utility
4Cited by
29References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 1990 |
| Grant date | Mar 1, 1994 |
| Priority date | — |
| Expiry date | Jul 23, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L67/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A low-profile additive composition is disclosed which comprises ethylene glycol, at least one nonpolar diol, adipic acid and trimellitic anhydride. The low-profile additive, when included in an unsaturated polyester resin systems, for use in making sheet molding compositions, provides improved processing characteristics such as viscosity thickening plateau, paste viscosity and phase separation during maturation when the unsaturated polyester.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.