Epoxy resin adhesive composition
US5290857A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 3, 1992 |
| Grant date | Mar 1, 1994 |
| Priority date | — |
| Expiry date | Sep 3, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/902
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An epoxy resin adhesive composition has excellent adhesive properties such as impact resistance, tensile shear strength and T-peel strength as well as excellent semi-gelling property. An epoxy resin adhesive composition comprising ionic crosslinking in a polymer utilized as the impact resistance modifier has not only excellent semi-gelling property and mechanical properties of cured products but also excellent storage stability for a long time and it is advantageously utilized when the application occasionally requires storage or standing of the material for one month to one year at the room temperature. The epoxy resin adhesive composition comprises an epoxy resin, a powder core/shell polymer and a heat activation type hardener for epoxy resins. The powder core/shell polymer is composed of a core comprising an acrylate polymer or a methacrylate polymer having a glass transition temperature of -30.degree. C. or lower and a shell comprising an acrylate polymer or a methacrylate polymer comprising crosslinking monomer units having a glass transition temperature of 70.degree. C. or higher and weight ratio of the core to the shell is in the range from 10/1 to 1/4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.