Moisture-proof electrical circuit high density interconnect module and method for making same
US5291066A · kind A · utility
87Cited by
13References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1991 |
| Grant date | Mar 1, 1994 |
| Priority date | — |
| Expiry date | Nov 14, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A moisture-proof integrated circuit module includes at least one integrated circuit component in a high density interconnect (HDI) structure fabricated by applying to a substrate successive multiple ply sequences having a plurality of via holes therein. The sequences overlie the component(s) and the module substrate, and each sequence includes a dielectric film and a plurality of lands comprised of metal that extends into the vias of the sequence to provide electrical interconnections. The module includes at least one moisture barrier film to prevent penetration of moisture through the module to the circuit component(s).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.