Integral heat sink-terminal member structure of hybrid integrated circuit assembly and method of fabricating hybrid integrated circuit assembly using such structure
US5291372A · kind A · utility
7Cited by
6References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 23, 1992 |
| Grant date | Mar 1, 1994 |
| Priority date | — |
| Expiry date | Sep 23, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10924
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integral heat sink-terminal structure for a hybrid circuit assembly includes a heat dissipating plate for bonding to a substrate of the hybrid integrated circuit and terminals for connection to the substrate. The heat dissipating plate and the terminals are unitary with a common frame in the same predetermined positional relationship relative to the substrate before and after they are connected to the substrate. When this structure is used in fabricating a hybrid integrated circuit assembly, the heat dissipating plate is first bonded to the substrate and then the terminals are connected to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.