Solventless or high solids-containing silicone pressure sensitive adhesive compositions
US5292586A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 1991 |
| Grant date | Mar 8, 1994 |
| Priority date | — |
| Expiry date | Mar 26, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Solventless or low solvent-containing silicone pressure sensitive adhesive compositions having excellent adhesive strength and high tack are provided, comprising (A) a toluene-soluble resinous copolymer containing R.sub.3 SiO.sub.1/2 units and SiO.sub.4/2 units; (B) a vinyi-endblocked polydiorganosiloxane having a viscosity of 10 to 500 centipoise at 250.degree. C.; (C) a hydride-endblocked polydiorganosiloxane having a viscosity of 10 to 1,000 centipoise at 250.degree. C.; the ratio of silicon-bonded hydrogen atoms in (C) to olefinically unsaturated radicals in the total of (A) and (B), being in the range of from about 1.2:1 to about 15.0:1; and (D) a hydrosilation catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.