Patent · US Expired

Thermosetting reactive resin mixture, moulded article and coating made therefrom

US5292833A · kind A · utility

13Cited by

5References

23Claims

0Family size

Assignee

Dainippon Ink and Chemicals, Inc. · JP

Inventors

Gerwald Grahe · Berlin, DE
Arthur Lachowicz · Berlin, DE
Roland Fromme · Schwentinental, DE

Key dates

Filing date	Dec 30, 1991
Grant date	Mar 8, 1994
Priority date	—
Expiry date	Dec 30, 2011

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09D5/4434
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The invention relates to a thermosetting reactive resin mixture of PA1 a) at least one organic compound, which possesses at least two epoxide groups, PA1 b) at least one carbamate compound of the formulae I, II, III or IV, such as can be quoted from the claim petitions, PA1 c) at least one basic catalyst, and with or without PA1 d) other processing aids and/or additives. The thermosetting reactive resin mixture according to the present invention are used for chemically resistant coatings, as cross-linked, no longer soluble and infusible moulded articles, for the production of cathodically precipitable electrophoretic enamels, and for the production of coating powders and automobile paints.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.