Process for the formation of a conductive circuit pattern
US5294291A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 1992 |
| Grant date | Mar 15, 1994 |
| Priority date | — |
| Expiry date | Sep 21, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process is provided for the formation of a conductive circuit pattern on a base metal formed on a substrate. On the base metal, a plating resist is first provided in a pattern corresponding to the circuit to be formed and a circuit pattern is then formed by plating. The plating resist is treated with a stripper and then with a stripping residue remover to cut off chemical bonds in the resist by a dehydrating decomposition reaction. The base metal is treated with an etchant for the base metal, whereby any resist residue still remaining after the treatment with the stripping residue remover is removed and the base metal are etched at areas which were covered by the plating resist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.