Surface mountable molded electronic component
US5294749A · kind A · utility
7Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1991 |
| Grant date | Mar 15, 1994 |
| Priority date | — |
| Expiry date | Sep 23, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A surface mountable molded electronic component (100) is made from formed wire having a main portion (202) and end portions (102 and 104) connected to the main portion (202). The electronic component (100) includes a first and second recess areas (108 and 110) in molded section (114) for allowing the end portions (102 and 104) to lie inside and provide for the component (100) to be surfaced mounted onto a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.