Ceramic packages and ceramic wiring board
US5294750A · kind A · utility
30Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 1991 |
| Grant date | Mar 15, 1994 |
| Priority date | — |
| Expiry date | Sep 16, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ceramic package for containing a semiconductor chip including a heat radiating plate, a base plate for wiring, and a ceramic package for containing a semiconductor chip. The package contains a ceramic board, a ceramic cap and a metal lead frame. The heat radiating plate and the ceramic board are made of silicon nitride sintered body, which is characterized in that the number of grain boundaries per a 10 .mu.m straight line drawn in an arbitrary section of the sintered (polycrystal) body is 20 or fewer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.