Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
US5294835A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1992 |
| Grant date | Mar 15, 1994 |
| Priority date | — |
| Expiry date | Jul 28, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48465
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device in which a semiconductor chip is encapsulated in an epoxy resin composition comprising (A) an epoxy resin represented by formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, and R.sub.4 each represents an alkyl group having from 1 to 4 carbon atoms, and (B) a reaction product obtained by preliminarily reacting a silane compound represented by formula (II): ##STR2## wherein X represents a monovalent organic group having at least one functional group selected from the group consisting of a glycidyl group, an amino group, and a mercapto group; Y represents an alkoxy group having from 1 to 4 carbon atoms; and n represents 0, 1 or 2, with a phenol aralkyl resin represented by formula (III) ##STR3## wherein m represents 0 or a positive integer. The epoxy resin composition has low moisture absorption and low stress to provide a semiconductor device excellent in thermal crack resistance and moisture resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.