Raised feature/gold dot pressure interconnections of rigid-flex circuits and rigid circuit boards
US5295838A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1993 |
| Grant date | Mar 22, 1994 |
| Priority date | — |
| Expiry date | Jan 14, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer rigid-flex circuit (20) is formed of a number of flexible layers (62-70) on a rigid substrate (100) with individuals ones of the layers having laterally projecting arms (32,38) that define flexible circuit connections to individual ones of a number of ceramic circuit boards (10,12,14,16). The laterally projecting flexible arms (32,34,36,38) are each formed with gold dot or projecting feature pressure contacts (40a-40g) which are pressed against mating sets of circuit board contact pads (40a-40g) by a clamping bar (120) that is bolted to the rigid circuit board. Thus the interconnections between the rigid-flex circuit and the circuit boards are effectively built into the rigid-flex circuit, requiring only a clamp to complete the connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.