Two-component curable hot melt compositions
US5296557A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 2, 1992 |
| Grant date | Mar 22, 1994 |
| Priority date | — |
| Expiry date | Jul 2, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J177/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to two-component curable hot-melt compositions comprising thermoplastic polyamide resins that are substantially free of piperazine-containing polyamines. In one preferred embodiment the polyamide resins are the reaction product of an acid component with an amine component, wherein the amine component consists essentially of about (i) 20 to 100 equivalent percent of one or more acyclic diamines selected from the group consisting of 2-methyl-1,5-pentanediamine, 1,3-pentanediamine, 1,3-propanediamine, 1,5-pentanediamine, 1,7-heptanediamine, 1,9-nonanediamine, methyl-1,9-nonanediamine, 1,2-propanediamine, and 2-methyl-1,2-diaminopropane, and (ii) about 0 to 80 equivalent percent of one or more polyamines selected from the group consisting of cyclic and acyclic polyamines other than those amines of (i). The compositions possess excellent heat resistance, flexibility, elasticity and resistance to solvents, including organic solvents and water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.