Polyimide composition
US5296559A · kind A · utility
2Cited by
32References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1991 |
| Grant date | Mar 22, 1994 |
| Priority date | — |
| Expiry date | Dec 19, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition that includes a finely divided, fully imidized, polyimide dispersed in a non-volatile, fluidizing resin that is a liquid or low viscosity semi-solid at room temperature. The fluidizing resin is substantially insoluble in the polyimide at room temperature, but soluble in the polyimide at the elevated temperatures during thermal processing. The composition has the flow characteristics of a highly filled liquid. The composition if useful, e.g., as an adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.