Curable resin composition
US5296582A · kind A · utility
15Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1991 |
| Grant date | Mar 22, 1994 |
| Priority date | — |
| Expiry date | Nov 18, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resin composition has a low viscosity, hence is easy to handle, before curing and, after curing, gives cured products having good tensile characteristics and, in addition, good chemical resistance and water resistance. This composition includes (A) an oxypropylene polymer having at least one silicon atom-containing group having a hydroxyl group or hydrolyzable group bound to the silicon atom and having an Mw/Mn ratio of up to than 1.6 and a number average molecular weight of at least 6,000, and (B) an epoxy resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.