High vacuum hot press
US5297480A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 1992 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | May 6, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4611
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A high vacuum hot press for producing a multi-layer board. The high vacuum hot press includes a pair of heat insulating members each comprising a heat insulating material and a thin metallic cover defining an evacuated hermetic space accommodating therein the heat insulating material. The heat insulating members are arranged on respective surfaces, facing each other on a pair of bolsters. A pair of hot plates are placed on the heat insulating members, respectively. A multi-layer workpiece is disposed between the hot plates in a sealed space in a sealing unit. The multi-layer work includes wafers and an adhesive base material. The sealed space is evacuated to a high vacuum by an evacuating unit, and the multi-layer workpiece is heated by a heating unit under a high vacuum. The high vacuum hot press is further provided with a bonding unit which shifts the bolsters relative to each other to open and close the sealing unit and to bond the wafers of the multi-layer workpiece to each others for producing the multi-layer board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.