Method of selectively monitoring trace constituents in plating baths
US5298129A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 13, 1992 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Nov 13, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/42
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of selectively monitoring particular trace constituents within a plating bath containing multiple trace constituents. The method provides improved selectivity over known voltammetric techniques for certain plating baths and trace constituents. The method involves applying a brief voltammetric plating signal to a pretreated electrode positioned within the plating bath solution, applying a rapid stripping signal to the plated electrode, and monitoring the resultant stripping signal response current. The characteristics of the stripping signal response current indicate the particular trace constituent concentration level. The method complements and is easily integrated with known voltammetric techniques and equipment, and thus improves the efficiency and versatility of existing plating bath analysis systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.