Method of monitoring metal ion content in plating baths
US5298131A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 1993 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | May 28, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/08
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of monitoring in-tank and on-line metal ion content within a plating bath. The method involves the steps of applying a pretreatment signal to a sensing electrode positioned within the plating bath, applying a sweep signal to the pretreated sensing electrode, and measuring the voltammetric peak current of the resultant response signal. The voltammetric peak current is proportional to the metal ion content of the plating bath. The method complements and is easily integrated with known voltammetric techniques for analysis of trace and major constituents, and is thus an integral part of an efficient overall plating bath analysis system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.