Method for monitoring purification treatment in plating baths
US5298132A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1993 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Mar 25, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/48
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for monitoring the status of a plating bath purification treatment cycle. The method involves applying a swept dc measurement signal to a pretreated electrode which is in contact with the plating solution, and monitoring the resultant response current signal. The electrode potential corresponding to the peak current density in the cathodic sweep of the response current signal provides an accurate indication of the status of the purification treatment cycle. The method tracks the progress of the purification process thereby ensuring the optimal termination points for the treatment process. The method can be used in conjunction with voltammetric plating bath analysis methods and equipment, as part of an overall plating bath monitoring and control system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.