Adhesive tapes for tape automated bonding
US5298304A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 1992 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Nov 23, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2896
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to an adhesive tape for tape automated bonding (TAB). A first type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by comprising at least resol-type phenol resin and polyamide resin, wherein from 2 to 35% of said resol-type resin is contained in the adhesive layer. A second type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by having at least two layers: one comprising at least polyamide resin and being laminated on one surface of said organic-insulating film and; other comprising at least polyamide resin and resol-type resin and being laminated on other surface of said protective film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.