Photosensitive heat-resistant polymer having hydroxyphenyl group for forming a patterned image
US5298359A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1991 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Apr 29, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/107
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photosensitive polymer containing a repeating unit represented by the following formula (I) and having a logarithmic viscosity number of from 0.1 to 5 dl/g as measured in a solvent at a temperature of 30.degree..+-.0.01.degree. C. at a concentration of 0.5 g/dl: ##STR1## (wherein R.sup.1 is a trivalent or tetravalent carbocyclic aromatic group or heterocyclic group, R.sup.2 is an aliphatic group having at least two carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbocyclic aromatic group, a heterocyclic group or a polysiloxane group, R.sup.3 is a divalent organic group, R.sup.4 is ##STR2## a hydrogen atom or a monovalent organic group, R.sup.5 is a hydrogen atom or a monovalent organic group, m is independently 1 or 2, n is independently 0 or 1, and m and n meet 1.ltoreq.m+n.ltoreq.2); a method for preparing the above-mentioned photosensitive polymer; a photosensitive polymer composition containing the above-mentioned photosensitive polymer; and a method for preparing a poly(amide)imide film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.