Substrate for packaging a semiconductor device
US5298460A · kind A · utility
43Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1992 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Dec 18, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4007
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate for packaging a semiconductor device having a bump thereon according to the present invention is characterized by that the substrate has an electrode terminal to which the bump is to be connected, the electrode terminal has a recess formed thereon to the receive at least a top of the bump, and at least a top of the surface of the electrode terminal is covered by a metal layer having a lower melting point than that of the bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.