Interconnection method and structure for organic circuit boards
US5298685A · kind A · utility
52Cited by
23References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1992 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Jul 14, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.